IBM Microprocessors to Power the New Wii U System from Nintendo

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Company's unique embedded DRAM is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience. 

IBM has announced that it will provide the microprocessors that will serve as the heart of the new Wii U system from Nintendo.  Unveiled at the E3 trade show this week, Nintendo plans for its new console to hit store shelves in 2012. 

The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience. 

IBM's state-of-the-art 300mm chip plant in East Fishkill, N.Y., will be the manufacturing facility for the new custom-designed game chip the company is building for Nintendo's new game console due to hit store shelves next year. 

IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter). 

The relationship between IBM and Nintendo dates to May 1999, when IBM was selected to design and manufacture the central microprocessor for the Nintendo GameCube system. Since 2006, IBM has shipped more than 90 million chips for Nintendo Wii systems. 

"IBM has been a terrific partner for many years.  We truly value IBM's commitment to support Nintendo in delivering an entirely new kind of gaming and entertainment experience for consumers around the world," said Genyo Takeda, senior managing director, Integrated Research and Development, at Nintendo Co., Ltd. 

"We're very proud to have delivered to Nintendo consistent technology advancements for three generations of entertainment consoles," said Elmer Corbin, director, IBM's custom chip business. "Our relationship with Nintendo underscores our unique position in the industry--how we work together with clients to help them leverage IBM technology, intellectual property and research to drive innovation into their own core products." 

Built on the open, scalable Power Architecture base, IBM custom processors exploit the performance and power advantages of proven silicon-on-insulator (SOI) technology. The inherent advantages of the technology make it a superior choice for performance-driven applications that demand exceptional, power-efficient processing capability–from entertainment consoles to supercomputers.

IBM is a leading global hybrid cloud and AI, and business services provider, helping clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. Nearly 3,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM's hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently, and securely. IBM's breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and business services deliver open and flexible options to our clients. All of this is backed by IBM's legendary commitment to trust, transparency, responsibility, inclusivity, and service.

For more information, visit: www.ibm.com.

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